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PD -9.1218
IRL620S
HEXFET(R) Power MOSFET
Surface Mount Available in Tape & Reel Dynamic dv/dt Rating Repetitive Avalanche Rated Logic-Level Gate Drive RDS(on) Specified at VGS=4V & 5V Fast Switching Description
Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low onresistance and cost-effectiveness. The SMD-220 is a surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface-mount package. The SMD-220 is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface-mount application.
VDSS = 200V RDS(on) = 0.80 ID = 5.2A
SMD-220
Absolute Maximum Ratings
Parameter
ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C PD @TA = 25C Continuous Drain Current, VGS @ 5.0 V Continuous Drain Current, VGS @ 5.0 V Pulsed Drain Current Power Dissipation Power Dissipation (PCB Mount)** Linear Derating Factor Linear Derating Factor (PCB Mount)** Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Junction and Storage Temperature Range Soldering Temperature, for 10 seconds
Max.
5.2 3.3 21 50 3.1 0.40 0.025 10 125 5.2 5.0 5.0 -55 to + 150 300 (1.6mm from case)
Units
A
W W/C V mJ A mJ V/ns C
VGS EAS IAR EAR dv/dt TJ, TSTG
Thermal Resistance
Parameter
RJC RJA RJA Junction-to-Case Junction-to-Ambient (PCB Mount)** Junction-to-Ambient
Min.
-- -- --
Typ.
-- -- --
Max.
2.5 40 62
Units
C/W
** When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques, refer to Application Note AN-994.
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IRL620S
Electrical Characteristics @ T = 25C (unless otherwise specified) J
V(BR)DSS
V(BR)DSS/TJ
RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD LS
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
Min. Typ. Max. Units Conditions 200 -- -- V VGS = 0V, ID = 250A -- 0.27 -- V/C Reference to 25C, ID = 1mA -- -- 0.80 VGS = 10.0V, ID = 3.1A -- -- 1.0 VGS = 4.0V, ID = 2.6A 1.0 -- 2.0 V VDS = VGS, ID = 250A 1.2 -- -- S VDS = 50V, ID = 3.1A -- -- 25 VDS = 200V, VGS = 0V A -- -- 250 VDS = 320V, VGS = 0V, TJ = 125C -- -- 100 VGS = 10V nA -- -- -100 VGS = -10V -- -- 16 ID = 5.2A -- -- 2.9 nC VDS = 160V -- -- 9.6 VGS = 5.0V, See Fig. 6 and 13 -- 4.2 -- VDD = 100V -- 31 -- ID = 5.2A ns -- 18 -- RG = 9.0 -- 17 -- RD = 20, See Fig. 10 -- 4.5 -- Between lead, 6mm (0.25in.) nH -- 7.5 -- from package and center of die contact -- 360 -- VGS = 0V -- 91 -- pF VDS = 25V -- 27 -- = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
IS
ISM
VSD trr Qrr ton
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time
Min. Typ. Max. Units Conditions MOSFET symbol -- -- 5.2 showing the A integral reverse -- -- 21 p-n junction diode. -- -- 1.8 V TJ = 25C, IS = 5.2A, VGS = 0V -- 180 270 ns TJ = 25C, IF = 5.2A -- 1.1 1.7 C di/dt = 100A/s Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes: Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 ) ISD 5.2A, di/dt 95A/s, VDD V(BR)DSS, TJ 150C Pulse width 300s; duty cycle 2%.
VDD = 50V, starting TJ = 25C, L = 6.9mH RG = 25, IAS = 5.2A. (See Figure 12)
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IRL620S
ID, Drain Current (Amps)
Fig 1. Typical Output Characteristics, TC = 25oC
ID, Drain Current (Amps)
Fig 2. Typical Output Characteristics, TC = 150oC
Fig 3. Typical Transfer Characteristics
RDS(on), Drain-to-Source On Resistance (Normalized)
ID, Drain Current (Amps)
Fig 4. Normalized On-Resistance Vs. Temperature
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IRL620S
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
VGS, Gate-to-Source Voltage (volts)
Capacitance (pF)
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
ISD, Reverse Drain Current (Amps)
Fig 7. Typical Source-Drain Diode Forward Voltage
ID, Drain Current (Amps)
Fig 8. Maximum Safe Operating Area
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IRL620S
ID, Drain Current (Amps)
Fig 10a. Switching Time Test Circuit
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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IRL620S
Fig 12a. Unclamped Inductive Test Circuit
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
Fig 12b. Unclamped Inductive Waveforms
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
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IRL620S
Fig 14. Peak Diode Recovery dv/dt Test Circuit
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IRL620S
Package Outline SMD-220
Part Marking Information SMD-220
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IRL620S
Package Outline SMD-220 Tape and Reel
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: (44) 0883 713215 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 3L1, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: 6172 37066 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: (39) 1145 10111 IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo 171 Tel: (03)3983 0641 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, 0316 Tel: 65 221 8371 Data and specifications subject to change without notice.
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